Semiconductor Device and Manufacturing Process Therefor

ABSTRACT

This invention relates to a semiconductor device having a beam made of a semiconductor to which strain is introduced by deflection, and a current is permitted to flow in the beam.

TECHNICAL FIELD

The present invention relates to a semiconductor device and amanufacturing process therefor, particularly to a semiconductor devicein which mobility is improved by strain and a manufacturing processtherefor.

BACKGROUND OF THE INVENTION

Recently, it has become significantly difficult to reduce the size of anintegrated circuit in accordance with the scaling rule. As one of thereasons, it has been difficult to restrain short-channel effect in a MOS(Metal-Oxide-Semiconductor) type FET (Field Effect Transistor) as anelementary element in an integrated circuit. For solving this problem,there has been proposed an FET having a double gate structure(Non-patent reference 1: Applied Physics, The Japan Society of AppliedPhysics, 2003, Vol. 72 (9), pp. 1136-1142). A double-gate structure FETmay have three configurations depending on arrangement of a sourceelectrode, a drain electrode and two gate electrodes as described inNon-patent reference 1, and among these, FinFET (Fin-type channel FET)is believed to be practically used because an existing integratedcircuit process may be easily applied to it.

FIG. 29 schematically shows a common FinFET as described in Non-patentreference 1. The FinFET is formed in an SOI (Silicon on Insulator) layeron a Si substrate 1 and a buried oxide film 2. The SOI layer has padsfor a source electrode 3 and for a drain electrode 4, which areconnected via a fin 5. There is formed a hard mask 9 in the uppersurface of the fin 5 under a gate electrode 6 and there is formed a gateinsulating film 7 between the side surface of the fin 5 and the gateelectrode 6. By forming such a structure, channels are formed in bothside surfaces of the fin 5, to realize a double gate structure. Such aFinFET is called as a double-gate type FinFET.

Besides a double-gate type FinFET, a triple-gate type FinFET is alsoknown, in which a channel is formed in the upper side of the fin 5 asshown in FIG. 30 (Non-patent reference 2: 2003 Symposium on VLSITechnology Digest of Technical Papers, 2003, pp. 133-134). A triple-gatetype FinFET is different from a double type FinFET in that a gateinsulating film 7 is formed instead of a hard mask 9 in the upper sideof the fin 5 under the gate electrode 6.

Meanwhile, for an existing bulk MOS device, a strained Si technique hasbeen investigated for improving channel mobility and increasing achannel speed to improve an ON current while a supply voltage isreduced. In this technique, a Si lattice spacing is changed by applyingstress to Si in a channel, to modulate a Si band structure. As a result,in a Si conduction band, degeneracy is broken to increase an electronoccupancy of a double degeneracy valley with a light effective mass andinterband scattering between a double degeneracy valley and a quadrupledegeneracy valley is inhibited, resulting in improvement in mobility. Ina valence band, it is believed that mobility is improved by breaking ofdegeneracy, inhibition of interband scattering between a light hole bandand a heavy hole band and reduction in an effective mass.

Strain Si techniques can be generally classified into two types,depending on the way of applying strain to a channel Si.

A first method involves epitaxial growth of a Si layer on a relaxed SiGelayer (FIG. 1 in Non-patent reference 3; Applied Physics, The JapanSociety of Applied Physics, Vol. 72 (3), 2003, pp. 220-290). First, asshown in FIG. 31, on a Si substrate 1 are sequentially formed a gradienttype SiGe buffer 17 and a lattice-relaxed SiGe 18. In the gradient typeSiGe buffer 17, a composition ratio X of Ge in SiGe is increased from 0%to x % (x is generally about from 10 to 30 or 40) toward the uppersurface of the substrate. In the lattice-relaxed SiGe 18, SiGe is grownto relax a lattice while maintaining a high composition ratio X of Ge inSiGe. Since a lattice constant of Ge is larger than that of Si,lattice-relaxed SiGe has a larger lattice constant than that of Si.Therefore, a Si layer grown on a lattice-relaxed SiGe 18 such that thelattice matching occurs, has a larger lattice constant than that of abulk Si and thus becomes a strained Si 19. When manufacturing a MOS typeFET using such a strained Si layer as shown in FIG. 31, strainintroduced in a channel improves mobility.

As shown FIG. 32, there is another method in which on a buried oxidefilm 2 is formed a lattice-relaxed SiGe 18 to form a SGOI (SiGe onInsulator) structure, on which a Si layer is grown to give a strained Si19 (FIG. 3 in Non-patent reference 3).

Previous experimental results for a (100) plane have shown that asubstrate Ge concentration x=25% (corresponding to about 1% strain)improves mobility by about 60 to 80% for electrons and about 20 to 50%for holes (FIG. 2 in Non-patent reference 3).

However, a relaxed SiGe layer giving strain to a channel Si layer hasmany dislocations and defects, so that it transfers dislocations anddefects to the channel Si layer, leading to tendency to ingeneratedislocations and defects in the channel Si layer. Thus, when using thefirst method, a single MOS transistor may operate while it is difficultto operate an integrated circuit. Even if the integrated circuitoperates, it is difficult to ensure a process yield.

The second method involves utilization of process strain. As processstrain, strain generated by a capping layer or an STI (Shallow TrenchIsolation) and so on can be used (Non-patent reference 4: InternationalElectron Device Meeting Technical Digest, 2001, pp. 433-436). Forexample, as shown in FIG. 33, a nitride film is used as a capping layer20 and a tension of the nitride film is utilized to apply strain to Siin a channel.

However, in the second method, strain is hard to be directly applied toa channel and it is difficult to control the amount of strain. It isbecause a capping layer or STI giving strain is distant from a channelregion and thus strain is applied to the channel region via anothersubstance.

SUMMARY OF THE INVENTION

An objective of the present invention is to provide a semiconductordevice in which carrier mobility is improved by introducing strain byemploying a novel structure. Another objective is to provide asemiconductor device with less dislocations or defects and a controlledamount of strain. Another objective is to provide a process formanufacturing such a semiconductor device.

The present invention relates to the followings.

[1] A semiconductor device wherein a current flows in a deflected beammade of a semiconductor.

[2] The semiconductor device as described in [1], wherein the beam has adoubly-clamped beam structure in which both ends are fixed and tensilestrain is applied in a beam direction.

[3] The semiconductor device as described in [1] or [2], wherein thebeam is used as a channel region in an FET.

[4] The semiconductor device as described in [3], wherein the FET is aFinFET which uses at least the side surface of the beam as a channelregion.

[5] The semiconductor device as described in [3], wherein the FET is aplanar type FET which uses the upper surface of the beam as a channelregion.

[6] The semiconductor device as described in any of [2] to [5], whereinthe center of the beam is in contact with a void bottom under the beam.

[7] The semiconductor device as described in [6], wherein the strain inthe beam is controlled by the length of the beam before the beam isdeflected and the depth of the void under the beam.

[8] The semiconductor device as claimed in claim 7, wherein thesemiconductor device comprises a plurality of FinFETs and comprises atleast two types of FinFETs in which strain is differently introduced byaltering at least one of the length of the beam before the beam isdeflected and the depth of the void under the beam.

[9] A process for manufacturing a semiconductor device wherein a currentflows in a deflected beam made of a semiconductor, comprising the stepsof:

-   -   forming a straight beam having a doubly-clamped beam structure        made of the semiconductor by forming a void under the beam;    -   filling the void with a liquid; and    -   contacting the center of the beam with the bottom of the void by        drying the liquid to form a deflected beam.

[10] The process for manufacturing a semiconductor device as describedin [9], wherein the liquid is water or mercury.

[11] The process for manufacturing a semiconductor device as claimed inClaim 9 or 10, further comprising preparing a substrate having a firstlayer made of the semiconductor constituting the beam and a second layerunder the first layer which is made of a material having a differentetching rate from the first layer before the forming the straight beamhaving a doubly-clamped beam structure,

-   -   wherein the forming the straight beam having a doubly-clamped        beam structure is forming a void in a part under the first layer        by etching off at least part of the second layer.

[12] A process for manufacturing a FinFET comprising the step of:

-   -   preparing an SOI substrate in which a buried insulating film and        a semiconductor layer are stacked on a substrate;    -   patterning the semiconductor layer to form a Fin having a given        width;    -   forming a void under the Fin by etching the buried insulating        film under the Fin to provide a straight beam;    -   filling the void with a liquid; and    -   contacting the Fin with the bottom of the void by drying the        liquid to deflect the Fin.

The present invention utilizes deflection for applied strain to asemiconductor layer. Particularly, by deflecting a beam from adoubly-clamped beam structure, strain is introduced in the beam inproportion to the amount of deflection. In such a structure, strain isintroduced differently from a conventional process in which strain isintroduced based on lamination of semiconductor layers different in alattice constant, so that dislocations or defects caused by a lowersemiconductor layer are avoided. Thus, it can improve reliability andgive a good process yield during production, resulting in asemiconductor device allowing for high speed operation. Unlike the casewhere strain is introduced by, for example, a capping layer, sincestrain can be directly controlled by deflection in this structure, thisstructure has advantage of facilitating designing of a semiconductordevice.

In one aspect of the manufacturing process according to the presentinvention, since utilizing sticking phenomenon caused by a liquidsurface tension while beam is deflected, dislocations or defects can beavoided, resulting in higher reliability and a good process yield.Furthermore, since strain can be easily controlled by deflection, thepresent invention has advantage of facilitating designing of asemiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows Embodiment 1 (double-gate type FinFET).

FIG. 2 shows Embodiment 1 (triple-gate type FinFET).

FIG. 3 is a process drawing illustrating a structure of Embodiment 1 inthe course of production (after forming a fin and an electrode pad).

FIG. 4 is a process drawing illustrating a structure of Embodiment 1 inthe course of production (after etching a buried oxide film).

FIG. 5 is a process drawing illustrating a structure of Embodiment 1 inthe course of production (during immersion in a liquid).

FIG. 6 is a process drawing illustrating a structure of Embodiment 1 inthe course of production (after removing a liquid by drying).

FIG. 7 is a process drawing illustrating a structure of Embodiment 1 inthe course of production (after filling a void under a fin with aninsulating film).

FIG. 8 is a process drawing illustrating a structure of Embodiment 1 inthe course of production (after removing a gate insulating film exceptthat under a gate electrode).

FIG. 9 is a process drawing illustrating a structure of Embodiment 1 inthe course of production (after ion implantation for forming anextension).

FIG. 10 is a process drawing illustrating a structure of Embodiment 1 inthe course of production (after forming a sidewall).

FIG. 11 shows Embodiment 2 (double-gate type FinFET).

FIG. 12 shows Embodiment 2 (triple gate type FinFET).

FIG. 13 is a process drawing illustrating a structure of Embodiment 2 inthe course of production (after removing a gate insulating film exceptthat under a gate electrode).

FIG. 14 is a process drawing illustrating a structure of Embodiment 2 inthe course of production (after ion implantation for forming anextension).

FIG. 15 is a process drawing illustrating a structure of Embodiment 2 inthe course of production (after forming a sidewall).

FIG. 16 shows Embodiment 3 (double-gate type FinFET).

FIG. 17 shows Embodiment 3 (triple gate type FinFET).

FIG. 18 is a process drawing illustrating a structure of Embodiment 3 inthe course of production (after forming a fin).

FIG. 19 is a process drawing illustrating a structure of Embodiment 3 inthe course of production (after CMP).

FIG. 20 is a process drawing illustrating a structure of Embodiment 3 inthe course of production (after forming an electrode pad).

FIG. 21 is a top view showing Embodiment 4.

FIG. 22 is a top view showing Embodiment 4.

FIG. 23 shows Embodiment 5 (triple gate type FinFET, employing slitcontact).

FIG. 24 shows Embodiment 5 (triple gate type FinFET).

FIG. 25 shows Embodiment 6 (planar type MOSFET).

FIG. 26 shows a first stage of a manufacturing process for Embodiment 6.

FIG. 27 shows a middle stage of a manufacturing process for Embodiment6.

FIG. 28 shows a latter stage of a manufacturing process for Embodiment6.

FIG. 29 shows a device structure of a conventional double-gate typeFinFET.

FIG. 30 shows a device structure of a conventional triple gate typeFinFET.

FIG. 31 is a cross-sectional view showing a device structure of aconventional strained Si MOSFET.

FIG. 32 shows a device structure of a conventional strain SOI MOSFET.

FIG. 33 is a cross-sectional view showing a device structure of aconventional MOSFET in which strain is applied by a capping layer.

FIG. 34 is a drawing for illustrating a beam structure according to thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

A semiconductor device of the present invention is configured such thatcarriers (electrons and/or holes) move in a deflected beam, that is, acurrent flows. In the deflected beam, strain is introduced to give asemiconductor device capable of operating at a high speed becausemobility of moving carriers in the beams is improved. It can be,therefore, applied to various devices in which electrons and/or holesmove in a deflected beam and their moving velocity is responsible fordevice performance. A typical example is an aspect in which in FET(Field Effect Transistor), a deflected beam is used as a channel region.

Particularly, in a structure where a deflected beam is a deflecteddoubly-clamped beam, tensile strain can be surely introduced into asemiconductor layer constituting the beam. A doubly-clamped beam is abeam fixed at both ends, and tensile strain can be introduced in a beamdirection by deflecting the doubly-clamped beam.

A beam structure of the present invention will be described withreference to FIG. 34. FIG. 34(a) shows a beam before forming deflection.A beam 31 a has a beam length of L and fixed at fixed ends 32, 33 by afixing member 34, and thus the beam is in the air. A shape of the beam31 a may be appropriately altered in a width direction (in this figure,a depth direction to the paper) depending on a device structure asdescribed later, and may be thus a shape where a beam width is shorterthan its height or a planar shape where a beam width is considerablylarger than its height. The material of the beam is a semiconductor,particularly a single crystal semiconductor. Later specific exampleswill be described using Si as an example, but the material of the beamis not limited to Si and any semiconductor can be used, in which carriermobility can be improved by introducing strain (for example, SiGe, SiC,SiGeC and GaAs). The fixing member fixing both ends of the beam 31 a maybe appropriately made of a material which can be used in a semiconductordevice such as semiconductors and insulators.

A deflected beam of the present invention has a structure in which thestraight beam 31 a in FIG. 34(a) is deflected as shown in FIG. 34(b).Since the deflected beam 31 as a whole is elongated in comparison withthe straight beam 31 a, a crystal lattice spacing in a beam direction iswider to introduce tensile strain in a semiconductor layer. The amountof strain introduced into the semiconductor layer depends on anelongation rate.

As shown in FIG. 34(b), the length of an elongated beam after deflectionand strain introduced can be estimated from an initial beam length L anda deflection amount d as follows, in which d is a deflection amount inthe center of the beam, assuming for convenience that a deflected beamis an arc with a radius of R (>>beam height “h”).R=d/2+L ²/8/dLength of a deflected beam=2R tan⁻¹(L/2/(R−d))

According to this model, for example, 1% strain can be realized withL=320 nm and d=20 nm, and 0.5% strain can be realized with L=460 nm andd=20 nm.

In a semiconductor device of the present invention, a deflected beamwith the least deflection may be effective for introducing strain, but,for example, deflection is preferably generated such that strain is 0.1%or more, preferably 0.2% or more, further preferably 0.5% or more. Theupper limit of strain applied is strain at which elastic failure occursin a semiconductor layer and deflection can be generated within such arange. For example, a strain amount is, further depending on across-sectional shape of the beam, preferably 5% or less, particularly3% or less, more particularly 2% or less in the light of avoidingelastic failure.

Such a strain amount can be accurately determined from a differencebetween a deflected beam length and a straight beam length L, but aratio of L to d can be determined such that a given strain amount can beobtained according to the above-mentioned model.

When using a deflected beam as a channel region in an FET, the FET maybe either a FinFET or a planar type FET. When it is a FinFET, a beamwidth (that is, a fin width) and a beam height h (that is, a fin height)are, but not limited to, about 5 to 100 nm and 10 to 200 nm,respectively. Absolute values of a straight beam length L and a centraldeflection d are determined, further taking a beam height h intoaccount, and L is 10 nm or more, preferably 50 nm or more, furtherpreferably 100 nm or more. Since too large L may lead to excessivelylarge d for applying strain required, L is generally 100,000 nm or less,preferably 10,000 nm or less. Generally, d is more than 0, preferably 1nm or more, further preferably 5 nm or more while being generally 10,000nm or less, preferably 1,000 nm or less, further preferably 100 nm orless in the light of problems in a process. L and d are determinedwithin these ranges to obtain a given strain amount.

When an FET is a planar type FET, a beam must have such a size that anelement can be formed in its upper surface, and a beam width is 50 nm ormore, preferably 100 nm or more. Since a too large beam width tends tomaking it difficult to form a void under the beam, the width isgenerally 10,000 nm or less, preferably 1,000 nm or less. A beam heighth (thickness) is, for example, 10 to 200 nm. L and d may be determinedsubstantially as in a FinFET

Next, there will be described a manufacturing process according to thepresent invention.

A method for deflecting a beam is preferably a method where a straightbeam is formed, then the beam and a void under the beam are filled witha liquid and the liquid is subsequently removed by drying. As shown inFIG. 34(a), when forming the straight beam 31 a, then filling the void35 under the beam with liquid and removing the liquid by drying, surfacetension of the liquid allows the beam in the beam structure to be pulledtoward the bottom part of the void 35 (the side of the substrate),resulting in deflection. Furthermore, when the force is larger than arestoring force of the beam structure, the beam permanently contactswith the bottom part of the void while the beam remains deflected.

The liquid used herein may be, for example, an organic solvent, water ormercury, and water and mercury are preferable because they have a largesurface tension and tend to generate deflection.

Drying in the present invention is preferably drying while keeping asurface tension as a liquid; for example, a drying process passingthrough a gas-liquid equilibrium curve in a substance phase diagram. Anydrying method in such a type of drying method may be used; for example,spin drying, dry nitrogen blowing, heating of a wafer and drying underreduced pressure. Supercritical drying passing through a supercriticalstate or drying method such as lyophilization is not preferable, whichdoes not pass through a gas-liquid equilibrium curve in a substancephase diagram. It is because a surface tension of the liquid isineffective and thus the beam in the beam structure can not be deflectedin a liquid drying process which does not pass through a gas-liquidequilibrium curve in a substance phase diagram.

Next, there will be described a specific aspect of the presentinvention.

Embodiment 1

Structure

FIGS. 1 and 2 schematically show a structure of a semiconductor deviceas Embodiment 1 of the present invention. FIG. 1(a) is a top view, andFIGS. 1(b), (c) and (d) are cross-sectional views taken on lines A-A′,B-B′ and C-C′ of FIG. 1(a), respectively. FIG. 2(a) is a top view andFIGS. 2(b), (c) and (d) are cross-sectional views taken on lines A-A′,B-B′ and C-C′ of FIG. 2(a). FIG. 1 shows a double-gate type FinFETbefore forming a silicide. FIG. 2 shows a triple gate type FinFET beforeforming a silicide.

The semiconductor device of Embodiment 1 is a FinFET where a fin 5 has adeflected beam structure and its center is in contact with a substrate(with a buried oxide film 2) as shown in FIGS. 1(d) and 2(d).

The pads of a source electrode 3 and a drain electrode 4 at the bothends are fixed to the substrate (the buried oxide film 2) as in aconventional FinFET. For forming a state where the fin 5 is deflected tobe in contact with the substrate (the buried oxide film 2), the buriedoxide film 2 under the fin 5 is dug. Although there are formed spacesunder the fin 5 near the pad of the source electrode 3 and under the fin5 near the pad of the drain electrode 4 which are not present in aconventional FinFET, these are filled with an insulating film 15 underthe fin.

As described later, the fin 5 is originally formed in a shape similar tothat in a conventional FinFET, and then fixed in the state in contactwith the substrate (the buried oxide film 2) to become a deflectedshape. Microscopically, a lattice spacing in Si constituting the fin 5is extended in the C-C′ direction by deflection of the fin 5 and thusthe region of the fin 5 is strained Si. It leads to improvement incarrier mobility, and therefore, the fin 5 is used as a channel in theFinFET.

Since this constitutes a FinFET, its basic configuration is the same asconfiguration in a conventional FinFET (a double-gate type is shown inFIG. 29 and a triple gate type is shown in FIG. 30). In either of FIG. 1or FIG. 2, a FinFET is formed on an SOI substrate having the Sisubstrate 1, the buried oxide film 2 and an SOI layer (a layer havingthe source electrode 3, the drain electrode 4 and the fin 5). In thedouble-gate type FinFET shown in FIG. 1, a hard mask 9 is formed in theupper surface of the fin 5 and a gate insulating film 7 is formed onboth side surfaces, and a gate electrode 6 is formed, surrounding these.Since the thick hard mask 9 is formed in the upper surface of the fin,the upper surface of the fin does not work as a channel. On the otherhand, in the triple gate type FinFET as shown in FIG. 2, a gateinsulating film 7 is formed on the upper surface and both side surfacesof the fin 5 and the gate electrode 6 is formed, surrounding them. Inthis triple gate type, on the upper surface of the fin, a channel isalso formed.

On the side of the gate electrode 6, a sidewall is formed. The sourceelectrode 3 and the drain electrode 4 including their pads are dopedfrom the surface to the interface of the buried oxide film 2 or thelower part of the fin into an n-type in an n-type FinFET or a p-type ina p-type FinFET, to be deep electrodes. The source electrode 3 and thedrain electrode 4 are connected to an extension with a smaller junctiondepth and the same doping type. There may be formed, near the extension,a halo with a conduction type different from that of the extension (notshown). A channel is generally doped into a p-type in an n-type FinFETand an n-type in a p-type FinFET, but it may be used as an i-typewithout being doped.

Manufacturing Process

There will be described a manufacturing process of Embodiment 1 withreference to FIGS. 1 to 10. With reference to FIGS. 3 to 10, there willbe described a manufacturing process for a triple gate type FinFET (FIG.2) which is the same manufacturing process as a double-gate type FinFET(FIG. 1) except some elements. The difference will be described later.

For manufacturing the semiconductor device of this embodiment, as in theconventional art, a base is an SOI substrate having a Si substrate 1, aburied oxide film 2 and an SOI layer (a layer having a source electrode3, a drain electrode 4 and a fin 5). A thickness of the SOI layer in thesubstrate is determined, taking into account a loss in the resistremoval steps and the sacrifice oxidation steps in the process describedlater. For example, when a final fin height is 40 nm, an SOI substratehaving an SOI layer with a thickness of 50 nm is used.

First, channel implantation is carried out as follows. On an SOI layeris formed a sacrifice oxidation film for channel implantation to 16 nmby, for example, wet oxidation. Then, lithography is executed and ap-type dopant is ion-implanted in a region to be an n-type FinFET Forexample, monovalent boron is ion-implanted at an acceleration energy of12 keV and a dosage of 8×10¹² cm⁻². After ion implantation of the p-typedopant, the resist is removed. Then, lithography is conducted and ann-type dopant is ion-implanted in a region to be a p-type FinFET Forexample, monovalent phsphorous is ion-implanted at an accelerationenergy of 33 keV and a dosage of 3×10¹² cm⁻². After ion implantation ofthe n-type dopant, the resist is removed. After channel implantation,the sacrifice oxidation film is removed.

Next, as shown in FIG. 3, lithography and dry etching are carried out toform a pattern of a pad of the source electrode 3, a pad of the drainelectrode 4 and the fin 5 in the SOI layer. After etching, the resist isremoved.

Then, as shown in FIG. 4, the buried oxide film 2 is isotropicallyetched under the conditions where a selection ratio to Si in etching islarge. An example is etching with hydrofluoric acid. Herein, whileundercut proceeds under the pattern, a void is formed under the finbecause of a smaller width of the fin, so that the fin is in the air(FIGS. 4(c) and (d)), to form a beam structure. On the other hand, sincethe pad of the source electrode 3 and the pad of the drain electrode 4are large in size, they remain to be fixed on the substrate (the buriedoxide film 2) while undercut proceeds under them. In other words,etching by undercut can be executed to be equal to or more a half of thewidth of the fin 5, so that the fin 5 can be in the air to form a beamstructure. Here, a beam length is L and a void depth under the beam isd.

Then, as shown in FIG. 5, the fin 5 having the beam structure isimmersed in a liquid 13. When using, for example, water as the liquid13, after the etching with hydrofluoric acid in FIG. 4, the wafer isimmersed into water while hydrofluoric acid remains on the wafer, tothoroughly replace the liquid on the wafer with water.

Then, the liquid 13 is removed by drying (FIG. 6). Here, the fin 5 ispulled toward the lower part direction of the substrate by a surfacetension of the liquid, and when the force is larger than a restoringforce of the fin 5, the fin 5 is in contact with the substrate (theburied oxide film 2) with the fin 5 deflecting. Even after completeremoval of the liquid, the deflected fin 5 remains in the state by anadherence of the substrate surface.

Such a phenomenon is called sticking phenomenon (adherence phenomenon),and well-known in the field of micromachines (for example, MasayoshiEsashi ed., “Micromachine—a small and high-performance system in whichvarious elements are integrated”, Industrial Technology Service Center,Feb. 18, 2002, pp. 221-230, Jiro Sakata “Section 3: Measures toSticking”). However, in the field of micromachines, once an originallymovable portion is fixed on the substrate by adhesion, it becomesuseless as a machine, and therefore, sticking phenomenon (adherencephenomenon) is generally a problematic phenomenon and some treatment isconducted to avoid this phenomenon.

In the manufacturing process of the present invention, this stickingphenomenon (adherence phenomenon) is willingly used to deflect the fin.Microscopically, a lattice spacing of Si in a C-C′ direction is expandedto give a strained Si. The present invention is most markedlycharacterized in that a strained Si thus formed is used for, forexample, a channel in an FET.

Drying can be carried out, as described above, by any drying methodwhich passes through a gas-liquid equilibrium curve in a substance phasediagram, such as spin drying, dry nitrogen blowing, wafer heating anddrying under reduced pressure.

Although water has been used as an example of the liquid 13, it may bepossible to use a liquid having a larger surface tension than water foreasier deflection. However, such a liquid is limited to mercury, whichmust be deliberately handled in the light of safety to the human body.

After applying strain to the fin 5, the space under the fin 5 is filledwith an insulating film 15 (FIG. 7). For example, a thin oxide film isformed to 2 nm (not shown), and then Si₃N₄ is deposited to 60 nm. Here,Si₃N₄ is deposited by CVD (Chemical Vapor Deposition), such that thespace under the fin is also filled with the insulating film. Then, Si₃N₄is etched back. After the etching back, the etching task is stopped atthe time when Si₃N₄ except that under the fin 5 has been removed, andthe oxide film on the upper surface and both side surfaces of the fin 5is removed. The insulating film under the fin 5 may be a monolayer SiO₂or a monolayer Si₃N₄.

Subsequently, as a gate insulating film 7, for example, an oxide film isformed to 1.8 nm. The gate insulating film 7 may be, in addition to anoxide film and an oxynitride film, a so-called High-K film such asTa₂O₅, Al₂O₃, HfO₂, ZrO₂, ZrON, HfON, HfAlON and HfSiON. After formingthe gate insulating film 7, a gate electrode material (for example, 100nm of poly-Si) is deposited and then lithography and etching areexecuted to form a gate electrode 6. A gate electrode material may be,in addition to poly-Si and poly-SiGe, a metal such as TaN, TiN, W and WNor NiSi in which poly-Si is completely silicided. Alternatively, a gatestructure may be used, in which combined materials are stacked, such asa metal stack gate and a stacked gate of poly-Si and a metal. Afterforming the gate electrode 6, the resist is removed and then the gateinsulating film 7 except that under the gate electrode 6 is removed(FIG. 8).

Then, as shown in FIG. 9, extension implantation is conducted to form anextension region 10 in the side surface and the upper surface of theFin. For extension implantation, lithography is executed and an n-typedopant is ion-implanted in the region to be an n-type FinFET. Forexample, monovalent arsenic is ion-implanted at an acceleration energyof 2.5 keV and a dosage of 5×10¹⁴ cm⁻². Here, ion implantation iscarried out twice at an angle of 45° such that ions are implanted toboth side surfaces of the fin 5. After ion implantation of the n-typedopant, the resist is removed. Then, lithography is conducted and ap-type dopant is ion-implanted in the region to be a p-type FinFET. Forexample, monovalent BF₂ is ion-implanted at an acceleration energy of3.5 keV and a dosage of 6×10¹⁴ cm⁻². Again, ion implantation is carriedout twice at an angle of 45° such that ions are implanted to both sidesurfaces of the fin 5. After ion implantation of the p-type dopant, theresist is removed.

Then, first, a material to be a sidewall insulating film, for example,Si₃N₄ is deposited to 50 nm and etched back to form a sidewallinsulating film 8 (FIG. 10). The sidewall insulating film may be made ofSiO₂, or alternatively, a plurality of layers such as a lower layer ofSiO₂ to 10 nm and an upper layer of Si₃N₄ to 50 nm may be deposited andthen etched back to form a multilayer structure of sidewall.

Then, ion implantation is executed to form a deep electrode (a sourceelectrode and a drain electrode). For the purpose of this, first,lithography is conducted and an n-type dopant is ion-implanted in theregion to be an n-type FinFET. For example, monovalent arsenic ision-implanted at an acceleration energy of 8 keV and a dosage of 5×10¹⁴cm⁻² and then monovalent phosphorous is ion-implanted at an accelerationenergy of 5 keV and a dosage of 4×10¹⁵ cm⁻². After the ion implantationof the n-type dopant, the resist is removed. Then, lithography iscarried out and a p-type dopant is ion-implanted in the region to be ap-type FinFET. For example, monovalent boron is ion-implanted at anacceleration energy of 2 keV and a dosage of 3×10¹⁵ cm⁻². After the ionimplantation of the p-type dopant, the resist is removed. Then,activated annealing (for example, spike annealing at 1055° C. for 0 sec)is executed. Thus, the structure of FIG. 2 is formed.

Subsequently, a silicide step is conducted. For example, CoSi₂ is formedas a silicide. The silicide may be, in addition, NiSi, TiSi₂, CoSi₂,NiSi, PtSi or Pd₂Si. Finally, an inter-layer insulating film isdeposited, lithography and etching are conducted, a contact hole isformed and then the hole is filled with a metal to form a contact (notshown). A metal used for the contact may be selected from W, Al, TiN, Tiand their stacked films.

Although not being used in the above description, Si may be selectivelygrown after forming the sidewall (after FIG. 10) to form an elevatedstructure of the source electrode 3 and the drain electrode 4. Forexample, Si is selectively grown to about 30 nm by repeating the cycleof Si₂H₆ at a flow rate of 24 sccm for 10 sec at a substrate temperatureof 640° C. and Cl₂ at a flow rate of 1 sccm for 60 sec. After theselective growth of Si, ion implantation is carried out to form a deepelectrode.

In a double-gate type FinFET (FIG. 1), channel implantation isconducted, a sacrifice oxidation film is removed and then a hard mask 9is formed on a substrate. Then, lithography and dry etching are executedto print the pattern of a pad of the source electrode 3, a pad of thedrain electrode 4 and the fin 5 formed by lithography to the hard mask9. After removing the resist, the SOI layer is etched using the hardmask 9 as a mask. The subsequent process is the same as process in atriple gate type FinFET. However, in a double-gate type FinFET, althoughan extension implantation is carried out, extension is not formed in theupper surface of the fin 5 except a part in contact with the sidesurface because the hard mask 9 is present on the upper surface of thefin 5.

In this embodiment, a strain amount is controlled as follows. As shownin FIG. 6, an etching depth of the buried oxide film is defined as d,and a fin length before forming deflection is defined as L. L is the sumof the fin length L′ in FIG. 3, an undercut length under the pad of thesource electrode and an undercut length under the pad of the drainelectrode (FIG. 4), and when etching in FIG. 4 is isotropic, an undercutlength is equal to the etching depth d of the buried oxide film. Thatis, L=L′+2d. Assuming that only the center of the fin 5 is in contactwith the buried oxide film 2 and the deflected fin part is circular witha radius R (>>a fin height h), R=d/2+L²/8/d as described above and alength of the circular fin part is represented by 2R tan⁻¹(L/2/(R−d)),and thus 1% strain can achieved when L=320 nm, d=20 nm and 0.5% straincan achieved when L=460 nm, d=20 nm. Thus, in the present invention, astrain amount can be easily controlled by controlling a beam length L(or L′ before etching) and an etching depth d.

Modification of Embodiment 1

In the process of the present invention, different strain can be appliedto each FinFET constituting an integrated circuit. For example, when acertain FinFET is to be used as a conventional FinFET without strain,the FinFET can be masked after the process of FIG. 3, not to be etchedduring the buried oxide film etching in FIG. 4. Since the strain amountcan be controlled by L and d as described above, under a constant dcondition, strain can be controlled by altering L for each FinFET. Undera constant L condition, the amount of buried oxide film etching d isaltered for each FinFET. That is, buried oxide film etching is conductedmore than once appropriately in combination with masking of a FinFET, toapply different strain to each FinFET. These methods can be combined.

For example, a triple gate type FinFET is layouted such that the Fin inparallel to the X-axis using a (100) SOI wafer and keeping a <110> notchdown. Here, the upper surface of the Fin is a (100) plane while the sidesurface of the Fin is a (110) plane. Generally, in a (110) plane,electron mobility is reduced while hole mobility is increased, so thatin comparison with a triple gate type FinFET in which the side surfaceof the Fin is also a (100) plane, an ON current obtained in an n-typeFinFET is decreased and an ON current obtained in a p-type FinFET isincreased. Here, when the present invention is applied to only an n-typeFinFET while a p-type FinFET is of a conventional type, strain effectsallow electron mobility to increase, so that a current reduction in ann-type FinFET can be adequately compensated and resultantly ahigh-performance element can be obtained in either an n-type FinFET orp-type FinFET.

In the present invention, a fin material is not limited to Si, but othersemiconductor materials may be used. For example, by using an SGOIsubstrate as a film with no defects for conducting the above process ofthe present invention, a strain FinFET in which a channel material isSiGe can be provided.

Embodiment 2

There will be described Embodiment 2 of the present invention withreference to the drawings.

FIGS. 11 and 12 schematically show Embodiment 2 of a semiconductordevice of the present invention. FIG. 11(a) is a top view, and FIGS.11(b), (c) and (d) are cross-sectional views taken on lines A-A′, B-B′and C-C′ of FIG. 11(a), respectively. FIG. 12(a) is a top view, andFIGS. 12(b), (c) and (d) are cross-sectional views taken on lines A-A′,B-B′ and C-C′ of FIG. 12(a). FIG. 11 shows a double-gate type FinFETbefore forming a silicide. FIG. 12 shows a triple gate type FinFETbefore forming a silicide.

Embodiment 2 employs a manufacturing process different from that inEmbodiment 1, in which steps are reduced. Reflecting the difference, thestructures are partly different. Specific differences are a shape of thegate electrode 6 and an insulating film under the fin 5. The gateelectrode 6 in Embodiment 2 has a so-called notch type gate shape wherea region in contact with the gate insulating film 7 is shorter than thelength of the upper part of the gate. Since etching for forming such anotch type gate shape is used, there is a limitation that a fin width wmust be not more than a two-fold of the notch width (the reason will bedescribed later). The gate electrode material is also preferably amaterial by which a notch type gate can be easily formed (for example,poly-Si). In Embodiment 2, since the insulating film under the fin isformed concomitantly with the sidewall insulating film 8, the insulatingfilm under the fin is necessarily made of the same material as thesidewall insulating film 8. The structure of the other part is the sameas the structure in Embodiment 1.

There will be described a process for manufacturing in Embodiment 2 withreference to FIGS. 3 to 6 and 12 to 15. First, there will be described aprocess for manufacturing a triple gate type FinFET (FIG. 12), which issimilar to that for a double-gate type FinFET (FIG. 11) except someelements. The difference will be described later.

In Embodiment 2, first a sequence of processes for channel implantationare carried out as described in Embodiment 1, then as described inEmbodiment 1 with reference to FIGS. 3 to 6, a pattern of a pad of thesource electrode 3, a pad of the drain electrode 4 and the fin 5 isformed (FIG. 3), the fin 5 is formed in a beam structure (FIG. 4), thevoid under the fin is filled with a liquid (FIG. 5) and the liquid isremoved by drying to deflect the fin 5 (FIG. 6). Then, the space underthe fin 5 is filled with an insulating film in Embodiment 1 (FIG. 7),while in Embodiment 2, the fin 5 is deflected, then a gate insulatingfilm 7 is formed and a material for a gate electrode is deposited. Thus,the space under the fin is also filled with the material for a gateelectrode. Subsequently, lithography and gate etching are executed toform a gate electrode, where etching is conducted such that a notch typegate shape is formed.

Etching for forming a notch type gate shape is described in, forexample, Journal of Vacuum Science and Technology, P.2024-2031, VOL.B20,NO. 5, September/October, 2002. First, after etching a native oxidefilm, etching is anisotropically carried out under the conditions wherea sidewall protecting layer is formed, to etch about a half to ⅓ of thegate electrode layer. Then, the etching conditions are changed to thosewhere etching anisotropically proceeds without forming a sidewallprotecting layer and the etching is continued. The etching conditionsare changed immediately before etching reaches the gate insulating film,to ensure to stop the etching at the gate insulating film. Then, thelower part of the gate electrode without a sidewall protecting layer islaterally etched by changing the etching conditions. A series of suchetching processes can be sequentially conducted to form a notch typegate shape.

Basically, since the etching processes are sequentially executed varyinga gas, a power and a pressure, these can be continuously conducted inone chamber. For example, when etching a poly-Si gate electrode layer,etching is carried out using a CF₄/Al system which can etch a nativeoxide film, and then anisotropic etching is conducted while a sidewallprotecting layer is formed under the conditions of a HBr/Cl₂ system plusO₂. Subsequently, a gas system is changed to Cl₂ containing SF₆; etchingof the gate electrode layer is continued under the conditions where asidewall protecting layer is not formed; again the conditions arechanged to a HBr/Cl₂ system plus O₂, and etching is continued to a gateinsulating film. Then, after changing the conditions to HBr plus O₂, thelower part of the gate electrode without a sidewall protecting layer islaterally over-etched. Thus, etching can be continually executed whilechanging the etching conditions, to form a notch type gate shape inwhich the lower part of the gate is smaller than the upper part.

In an etching process for forming a notch type gate shape, etching ofthe gate electrode material reaches the buried oxide film 2 and then theetching laterally proceeds. Here, while the region in the gate electrode6 in contact with the gate insulating film 7 becomes smaller, the gateelectrode material under the fin 5 is simultaneously etched off bylateral etching.

That is, since the space under the fin 5 is not filled with aninsulating film before forming the gate electrode in Embodiment 2, thegate electrode material filling the space under the fin must be removed.Therefore, after forming the gate electrode in a common shape, etchingmust be conducted such that the etching proceeds laterally. Thus, anetching process whereby a notch type gate shape is formed is employed.

In Embodiment 2, a notch width (the amount laterally etched) cannot beincreased with no restriction, but since the width of one side isgenerally about 10 nm to 30 nm, the fin width w is limited to 2-fold orless of the one-side notch width (for example, when a notch width is 20nm, a fin width is 25 nm (<20 nm×2).). Without meeting the conditions,the gate electrode material under the fin 5 is not removed.

After etching the gate, the gate insulating film 7 except that under thegate electrode 6 is removed (FIG. 13). Then, extension implantation iscarried out (FIG. 14), and an insulating film to be a sidewall isdeposited. Then, it is etched back to form a sidewall. Here, in thisembodiment, the space under the fin can be simultaneously filled withthe sidewall insulating film (FIG. 15).

The subsequent process is the same process as in Embodiment 1. That is,if necessary, selective growth of Si is executed, lithography forforming a deep electrode is conducted, ion implantation is carried outand after the implantation, the resist is removed. Then, activatedannealing is conducted. Thus, the state shown in FIG. 12 is obtained.Further, a silicide is formed, an inter-layer insulating film isdeposited, lithography is executed, a contact hole is formed and theresist is removed. Then, a contact is formed.

Difference in a process between the double-gate type FinFET and thetriple gate type FinFET is the same Difference as in Embodiment 1. Thereare no particular differences in this embodiment.

As described above, this embodiment is advantageous in comparison withEmbodiment 1, in that a process is shortened in terms of the step offorming an insulating film under the fin (FIG. 7).

Embodiment 3

Next, there will be described Embodiment 3 of the present invention withreference to the drawings.

FIGS. 16 and 17 schematically show Embodiment 3 of a semiconductordevice of the present invention. FIG. 16(a) is a top view, and FIGS.16(b), (c) and (d) are cross-sectional views taken on lines A-A′, B-B′and C-C′ of FIG. 16(a), respectively. FIG. 17(a) is a top view, andFIGS. 17(b), (c) and (d) are cross-sectional views taken on lines A-A′,B-B′ and C-C′ of FIG. 17(a). FIG. 16 shows a double-gate type FinFETbefore forming a silicide. FIG. 17 shows a triple gate type FinFETbefore forming a silicide.

Embodiment 3 of the present invention is different from Embodiment 1 ina method for forming a pad of the source electrode 3 and a pad of thedrain electrode 4. Reflecting the difference, the structures are partlydifferent. A structural difference is that the pad of the sourceelectrode 3 and the pad of the drain electrode 4 are elevated. Thestructure of the other part is the same structure as in Embodiment 1.

There will be described a process for manufacturing Embodiment 3 withreference to FIGS. 18 to 20. First, there will be described a processfor manufacturing a triple gate type FinFET (FIG. 17), which is similarto that for a double-gate type FinFET (FIG. 16) except some elements.The difference will be described later.

In this embodiment, first channel implantation is carried out as inEmbodiment. Then, as shown in FIG. 18, lithography and dry etching areconducted to form only a pattern of the fin 5 in the SOI layer. Afterthe etching, the resist is removed. Here, the reason why unlikeEmbodiment 1 or 2, only the pattern of the fin 5 is formed is that sincethe pattern is a simple line and space, its pitch can be reduced to thelimit of lithography (for example, in the case of electron-beamlithography, when the pad of the source electrode 3 and the pad of thedrain electrode 4 are near the fin 5, a resolution of the fin 5 isreduced due to backscatter electrons during drawing the pads.). If thepitch can be reduced, a current per a unit width can be increased.Considering that the pitch is reduced to the limit of lithography, allof the fins 5 are preferably in the same direction in a chip.

Then, an insulating film 16 (for example, a stacked film of SiO₂ andSi₃N₄) for a subsequent CMP(Chemical Mechanical Polishing) step isdeposited; lithography and dry etching are executed to form a hole forthe pad of the source electrode 3 and a hole for the pad of the drainelectrode 4; and then the resist is removed. Then, a material for thepad of the source electrode 3 and the pad of the drain electrode 4 (forexample, poly-Si) is deposited and then CMP is carried out. Thus, thestate shown in FIG. 19 is obtained. Subsequently, the insulating film 16for CMP is removed (FIG. 20). Thus, after the state corresponding toFIG. 3 in Embodiment 1 has been formed, the process from FIG. 4 inEmbodiment 1 is conducted to obtain the state shown in FIG. 17.

In a double-gate type FinFET (FIG. 16), channel implantation isexecuted, a sacrifice oxidation film is removed and then a hard mask 9is formed on a substrate. Then, lithography and dry etching areconducted to print only the pattern of the fin 5 formed by lithographyon the hard mask 9. After removing the resist, the SOI layer is etchedusing the hard mask 9 as a mask. Then, an insulating film 16 for CMP isdeposited; lithography and dry etching are carried out to form a holefor the pad of the source electrode 3 and a hole for the pad of thedrain electrode 4; and the resist is removed. Here, in the case of thedouble-gate type FinFET, it is necessary to remove not only theinsulating film 16 for CMP but also the hard mask 9 on the fin 5. Thesubsequent process is the same process as in a triple gate type FinFET.However, in a double-gate type FinFET, although extension implantationis conducted, extension is not formed in the upper surface of the fin 5except a part in contact with the side surface because the hard mask 9is present on the upper surface of the fin 5 as described inEmbodiment 1. By the process described above, the state shown in FIG. 16is obtained.

Although a process as described in Embodiment 1 is conducted after FIG.20, a process as described in Embodiment 2 may be conducted after FIG.20.

In this embodiment, the fin 5 is formed in advance in comparison withEmbodiment 1 or 2 to allow the pitch of the fin 5 to be reduced to thelimit of lithography performance, resulting in an advantage that acurrent per a unit width can be increased. Another advantage is thatcontact formation including the silicide step can be easier because thepad of the source electrode 3 and the pad of the drain electrode 4 areelevated.

Embodiment 4

Next, there will be described Embodiment 4 with reference to thedrawings.

In Embodiment 4, an arrangement of the fin 5, the pad of the sourceelectrode 3 and the pad of the drain electrode 4 is different fromEmbodiments 1, 2 or 3. In Embodiments 1 to 3, a pair of the pad of thesource electrode 3 and the pad of the drain electrode 4 are connectedvia a plurality of the fins 5. In this embodiment, there will be shownan arrangement applicable to the present invention. FIGS. 21 and 22describing an arrangement are top views showing the FinFET prepared bythe manufacturing process of Embodiment 1, but a similar arrangement canbe applied to the FinFET prepared by the manufacturing process ofEmbodiment 2 or 3.

First, there are two cases where one fin 5 is connected to a pair of thepad of the source electrode 3 and the pad of the drain electrode 4 (FIG.21(a)) and where a plurality of (two or more) the fins 5 are connected(the case described above, for example FIG. 2(a)). Next, there is a casewhere a plurality of (two or more) pairs are aligned to one gateelectrode. FIG. 21(b) shows the case where multiple (two or more) pairsof the pads of source electrodes 3 and the pads of the drain electrodes4 connected to one fin 5 are aligned to one gate electrode, and FIG.21(c) shows the case where multiple (two or more) pairs of the pads ofthe source electrodes 3 and the pads of the drain electrodes 4 connectedto a plurality of fins 5 are aligned to one gate electrode.Alternatively, to one gate electrode can be aligned a pair of the pad ofthe source electrode and the pad of the drain electrode connected to onefin and a pair of the pad of the source electrode and the pad of thedrain electrode connected to a plurality of fins (FIG. 21(d)). In thelast case, the alignment order and the number of the pairs can bearbitrarily determined.

Furthermore, in the arrangement formed as identified above, adjacentelectrode pads can be assembled. For example, FIG. 22(e) shows anexample where pads of the source electrode 3 in FIG. 21(b) are assembledinto one. When assembling electrode pads, it is possible to assembleelectrodes constituting a pair of the pad of the source electrode 3 andthe pad of the drain electrode 4 to different gate electrodes. Forexample, in 22(f), the pad of the drain electrode in the upper FinFETand the pad of the source electrode in the lower FinFET are assembled.

In the present invention, any of the manufacturing process inEmbodiments 1 to 3 can be applied to a FinFET pattern formed byrepeating the above-mentioned arrangement given number of times, and nochanges are made in the process. Thus, the present invention can beapplied any FinFET layout within an integrated circuit.

Embodiment 5

There will be detailed Embodiment 5 with reference to the drawings.

FIGS. 23 and 24 schematically show Embodiment 5 of a semiconductordevice of the present invention. FIG. 23(a) is a top view, and FIGS.23(b), (c) and (d) are cross-sectional views taken on lines A-A′, B-B′and C-C′ of FIG. 23(a), respectively. FIG. 24(a) is a top view, andFIGS. 24(b), (c) and (d) are cross-sectional views taken on lines A-A′,B-B′ and C-C′ of FIG. 24(a). FIGS. 23 and 24 show a triple gate typeFinFET before forming a silicide.

Embodiment 5 is different from Embodiments 1 to 4 in either or both of aposition where the gate electrode 6 in the FinFET is formed, the numberof the gate electrodes formed. In Embodiments 1 to 4, the gate electrodeis formed at the center of the deflected fin in contact with thesubstrate. Furthermore, only one gate electrode is formed from one fixedend to the other fixed end of the deflected fin in contact with thesubstrate. In FIGS. 23 and 24, the gate electrode 6 in the FinFET isformed not at the center of the deflected fin 5 in contact with thesubstrate, but is formed at a position other than the center of thepoints substantially dividing the fin 5 into quarters. Furthermore, aplurality of (two or more) the gate electrodes are formed from one fixedend to the other fixed end of the fin 5. Accordingly, a length from onefixed end to the other fixed end of the fin 5 is longer than that in thecase where one gate electrode is formed. Since there is formed a contactat the center of the fin 5 in FIGS. 23 and 24, a length of the fin 5becomes longer by a length required for forming the contact and a lengthrequired for forming another gate electrode. Difference between FIG. 23and FIG. 24 is difference in taking an electrode at the center of thefin 5. In FIG. 23, so-called slit contact is employed, in which the fin5 whose upper surface has a silicide is surrounded by a metal forcontact. In FIG. 24, contact is taken by forming an electrode bydepositing an electrode material (for example, poly-Si) on the fin asdescribed in Embodiment 3.

Next, there will be described a manufacturing process of Embodiment 5.First, there will be described a process for manufacturing theembodiment in FIG. 23. The process for manufacturing the embodiment inFIG. 23 is the same process for manufacturing as described in Embodiment1 before forming a silicide. Although the state before forming asilicide is as shown in FIG. 23, then a silicide is formed, aninter-layer insulating film is deposited, lithography and etching areconducted, a contact hole is formed, and then the hole is filled with ametal to form a contact. Here, the contact at the center of the fin 5 isformed as a slit contact, in which contact is taken such that the metalcovers the fin.

Next, there will be described a process for manufacturing the embodimentin FIG. 24. The process for the embodiment in FIG. 24 is the sameprocess as describe in Embodiment 1 before contacting the fin 5 with thesubstrate. Then, the steps corresponding to FIGS. 19 and 20 inEmbodiment 3 are carried out to form an electrode 14 at the center.Specifically, an insulating film for CMP is deposited; lithography anddry etching are conducted to form a hole for the pad of the centralelectrode 14; and the resist is removed. Then, a material for thecentral electrode 14 (for example, poly-Si) is deposited and CMP isexecuted. Then, the insulating film 16 for CMP is removed.

Thus, after obtaining the state corresponding to FIG. 3 in Embodiment 1,the process from FIG. 4 in Embodiment 1 is conducted to obtain the statein FIG. 24. Then, a silicide is formed; an inter-layer insulating filmis deposited; lithography and etching are carried out, a contact hole isformed, and the hole is filled with a metal to form a contact.

As described in the examples of this embodiment (FIGS. 23 and 24), it isnot necessary in the present invention to form the gate electrode at thecenter of the deflected fin in contact with the substrate, but it can beformed at any appropriate position. There may be formed not only onegate electrode but also multiple (two or more) gate electrodes from onefixed end to the other fixed end of one deflected fin in contact withthe substrate.

Although a triple gate type FinFET has been described as an example inthis embodiment, to a double-gate type FinFET can be applied thefeatures that a gate electrode is not necessarily formed at the centerof the deflected fin in contact with the substrate, but can be formed atany appropriate position and that there may be formed not only one gateelectrode but also multiple (two or more) gate electrodes from one fixedend to the other fixed end of one deflected fin in contact with thesubstrate.

Embodiment 6

Next, there will be described Embodiment 6 of the present invention withreference to the drawings. Although there has been described a FinFETusing a deflected beam in the above embodiments, this embodiment showsan example where a deflected beam structure is used as a channel in aplanar type FET.

FIG. 25 shows the structure of the semiconductor device of Embodiment 6.FIG. 25(a) is a top view, and FIGS. 25(b), (c) and (d) arecross-sectional views taken on lines A-A′, B-B′ and C-C′ of FIG. 25(a).FIG. 25 shows the state of a planar type MOSFET before forming asilicide.

Embodiment 6 is a planar type MOSFET where Si in a channel is deflectedto be strained Si as shown in FIGS. 25(b) and (d). It has a significantstructural difference from a conventional MOSFET (for example, FIG. 33)in that both ends of the surface Si layer are fixed by an STI 11 and thebeam is deflected to be in contact with the substrate (practically, awell 12), and thus it is a characteristic of the present invention.Since the surface Si layer is fixed at both ends by the STI 11 anddeflected, a lattice spacing of Si constituting the surface Si layer ismicroscopically extended in a A-A′ direction (or C-C′ direction), to bestrained Si. Since strained Si allows mobility to be improved on theprinciple described above, this embodiment utilizes it as a channel of aplanar type MOSFET.

For obtaining a structure where the surface Si layer is deflected to bein contact with the substrate, the MOSFET of this embodiment has otherstructural differences from a conventional one. First, as shown in FIGS.25(a) and (c), a part of the STI surrounding the MOSFET is dug byetching back to be an STI 21. It is because an SON (Silicon on Nothing)structure is formed and used as a beam structure in this embodiment.After forming the beam structure, the beam is deflected for contact andthen the region under beam is filled with an insulating film asdescribed in Embodiment 1. However, it is generally difficult in aplanar type MOSFET to fill the inner part with an insulating film, andthe insulating film 22 fills only a part near the opening. Therefore, inthe cross-section taken on line A-A′ (FIG. 25(b)), spaces 23 are formednear the STI 11 under the source electrode 3 and near the STI 11 underthe drain electrode 4, while in the cross-section taken on line C-C′(FIG. 25(d)), these spaces are filled with the insulating film 22.

Since this embodiment is a basically planar type MOSFET, its basicconfiguration is the same configuration as in a conventional MOSFET (forexample, FIG. 33). The MOSFET of this embodiment is formed on a bulk Sisubstrate 1. In the upper surface of the strained Si 19 to be a channelis formed a gate insulating film 7, on which is further formed a gateelectrode 6. The source electrode 3 and the drain electrode 4 have anelevated structure, and doped into an n-type in the case of a n n-typeMOSFET or into a p-type in the case of a p-type MOSFET, to be a deepelectrode. The source electrode 3 and the drain electrode 4 areconnected to a shallow extension 10 having the same doping type.Furthermore, there may be formed a halo having a different conductiontype from the extension 10 in the vicinity of the extension 10 (notshown). The channel is doped into a p-type in the case of an n-typeMOSFET or into an n-type in the case of a p-type MOSFET Although notbeing shown, it is not necessary in the planar type MOSFET described inthis embodiment to form a gate electrode at the center of the deflectedbeam as described for the FinFET in Embodiment 5, but it may be formedat any appropriate position. Furthermore, a plurality of gate electrodescan be formed in a deflected beam.

Next, there will be described a process for manufacturing Embodiment 6with reference to FIGS. 26 to 28. Here, (a1), (b1) . . . (k1) in FIGS.26 to FIG. 28 are cross-sections taken on line A-A′ of FIG. 25 (althoughonly (g1) is a C-C′ cross-section), and (a2), (b2) . . . (k2) arecross-sections taken on line B-B′ of FIG. 25.

First, as shown in FIGS. 26(a 1) and (a 2), on a Si substrate 1 areepitaxially grown a SiGe layer 24 to a critical film thickness or lessand then a Si layer 25 on the SiGe layer. Here it is important that theSiGe layer has a film thickness adequately thinner than the criticalfilm thickness. Here, since the SiGe layer is not relaxed, its latticeconstant is a Si lattice constant. Unlike a lattice-relaxed SiGe 18 inFIGS. 31 and 32, there are little defects or dislocations. For example,on a (100) bulk Si substrate are epitaxially grown SiGe (Ge compositionratio x=0.18) to 15 nm and then Si to 20 nm.

Subsequently, as shown FIGS. 26(b 1) and (b 2), the STI 11 is formed andion implantation is conducted to form a well 12. Furthermore, thechannel is ion-implanted. In this step, for example, the STI 11 with adepth of 250 nm is formed. Then, lithography is carried out, and in theregion to be an n-type MOSFET, a p-type dopant is ion-implanted (forexample, monovalent boron at an acceleration energy of 150 keV and adosage of 1.5×10¹³ cm⁻²) to form a well 12. Furthermore, a p-type dopantis ion-implanted (for example, monovalent boron at an accelerationenergy of 30 keV and a dosage of 7×10¹² cm²) for ion implantation of thechannel region. After the ion implantation, the resist is removed. Then,lithography is again executed, and in the region to be a p-type MOSFET,an n-type dopant is ion-implanted (for example, monovalent phosphorousat an acceleration energy of 350 keV and a dosage of 1.5×10¹³ cm⁻²) toform a well 12. Then, an n-type dopant is ion-implanted (for example,monovalent arsenic at an acceleration energy of 100 keV and a dosage of2.8×10¹² cm⁻²) for ion implantation of the channel region. After the ionimplantation, the resist is removed.

Next, as a characteristic step in the MOSFET of the present invention,lithography and dry etching are conducted to etch back a part of the STIsurrounding the MOSFET as shown in FIG. 26(c 2), to form an STI 21. Theetching-back depth may be such that the side surface of the SiGe layer24 is exposed, and it may be etched back deeper than that the SiGe layer24. Since the Si layer 25 is delimited as a square by the STI in thisembodiment, the STI 11 on the upper and the bottom sides of thedelimited Si layer 25 is etched back to be an STI 21 in the arrangementin FIG. 25(a).

Then, as shown in FIGS. 26(d 1) and (d 2), only the SiGe layer 24 isselectively etched by isotropic plasma etching. As a result, a space 23is formed under the surface Si layer 25, to give an SON structure. Inthis embodiment, this SON structure is used as a beam structure.

After forming the SON structure, the SON structure is immersed in aliquid 13 as shown in FIGS. 27(e 1) and (e 2), as described inEmbodiments 1 to 5. The liquid 13 may be water.

Then, the liquid 13 is removed by drying as shown in FIGS. 27(f 1) and(f 2). During removing the liquid 13 by drying, the Si layer 25 ispulled toward the substrate direction by a surface tension of the liquidand deflected, and then be in contact with the substrate while keepingthe state. Even after removing the liquid, an adherence of the substrateallows the deflected Si layer 25 to remain the state without restoringthe deflected Si layer. Thus, a strained Si 19 to be a channel in theMOSFET is formed. In terms of a drying method, any drying method whichpasses through a gas-liquid equilibrium curve can be used. It is also asin a FinFET.

After forming the strained Si 19, the opening in the side surface underthe strained Si 19 is closed by filling it with the insulating film 22as shown in FIGS. 27(g 1) and (g 2). This step is carried out asfollows. First, for example, a thin oxide film is formed to 2 nm (notshown), and then Si₃N₄ is deposited to 50 nm. Here, Si₃N₄ is depositedby CVD. Then, Si₃N₄ is etched back. At the time when Si₃N₄ in the regionother than that under the strained Si 19 and the side surface is removedby the etching back, the etching back is stopped and the oxide film inthe upper surface of the strained Si 19 is removed. The insulating filmmay be a monolayer SiO₂ or a monolayer Si₃N₄. Here, a difference fromthe FinFET in Embodiment 1 is that since a channel width in a planartype MOSFET is not small like the Fin width of the FinFET, an insulatingfilm is not formed under the strained Si 19 under the center of thestrained Si 19, that is, the position on line A-A′ and thus the spaceremains (the state of FIG. 27(f 1) remains.). Only a region near theopening in the side surface like the position on line C-C′ is filledwith the insulating film 22 as shown in FIG. 27(g 1).

Then, a gate insulating film 7 is formed; a gate electrode material isdeposited; lithography and dry etching are conducted to form a gateelectrode 6. The gate insulating film 7 is removed except the regionunder the gate electrode 6 (FIGS. 27(h 1) and (h 2)). For example, anoxynitride film is formed to 1.2 nm, and then poly-Si is deposited to 75nm. In terms of the materials for the gate insulating film 7 and for thegate electrode, those described in Embodiment 1 can be, in addition tothe above materials, applied to this embodiment.

Subsequently, lithography and ion implantation are executed to form anextension 10 (FIGS. 28(i 1) and (i 2)). That is, an n-type dopant ision-implanted in the region to be an n-type MOSFET. For example,monovalent arsenic is ion-implanted at an acceleration energy 2 keV anda dosage of 5×10¹⁴ cm⁻². After the ion implantation of the n-typedopant, the resist is removed. Then, lithography is conducted and ap-type dopant is ion-implanted in the region to be a p-type MOSFET. Forexample, monovalent BF₂ is ion-implanted at an acceleration energy of 2keV and a dosage of 5×10¹⁴ cm⁻². After the ion implantation of thep-type dopant, the resist is removed.

Then, a sidewall insulating film 8 is formed (FIGS. 28(j 1) and (j 2)).For example, Si₃N₄ as a material to be a sidewall insulating film isdeposited to 50 nm, and then etching is conducted to form a sidewall.The sidewall insulating film may be any of the other materials or acombination of multiple materials described in Embodiment 1.

Subsequently, as shown in FIGS. 28(k 1) and (k 2), Si is selectively andepitaxially grown to form a elevated structure of the source electrode 3and the drain electrode 4. This structure is formed for reducing aresistance of the surface strained Si 19 during forming a contactbecause it is a thin film. The selective epitaxial growth of Si iscarried out as described in Embodiment 1.

Then, ion implantation is executed to form a deep electrode. Lithographyis conducted and an n-type dopant is ion-implanted in the region to bean n-type FinFET. For example, monovalent arsenic is ion-implanted at anacceleration energy of 8 keV and a dosage of 5×10¹⁴ cm⁻² and thenmonovalent phosphorous is ion-implanted at an acceleration energy of 5keV and a dosage of 4×10¹⁵ cm⁻². After the ion implantation of then-type dopant, the resist is removed. Then, lithography is conducted anda p-type dopant is ion-implanted in the region to be a p-type FinFET.For example, monovalent boron is ion-implanted at an acceleration energyof 2 keV and a dosage of 3×10¹⁵ cm⁻². After the ion implantation of thep-type dopant, the resist is removed. Then, activated annealing (forexample, spike annealing at 1055° C. for 0 sec) is conducted. Thus, theplanar type MOSFET in FIG. 25 is prepared.

Then, a silicide step is carried out as described in Embodiment 1, andthen a contact can be formed (not shown). The type of the silicide and ametal for the contact applicable to this embodiment are as described inEmbodiment 1.

As described above, a deflected beam structure can be used as a channelto prepare a planar type MOSFET.

Although a beam structure is deflected in an A-A′ direction in the abovedescription, it can be deflected in a B-B′ direction as a process. Tothat end, the etched-back STI 21 can be located at the position rotatedby 90°. Then, the same process can be conducted to prepare a planar typeMOSFET in which a beam structure deflected in a B-B′ direction is usedas a channel.

For example, since there have been a description that in a common planarp-type MOSFET having a channel in a <110> direction formed on a bulkSi(100) substrate, mobility can be experimentally more improved byapplying tensile strain in a parallel direction to a gate electrode thanin a vertical direction, deflection in a B-B′ direction is better thandeflection in an A-A′ direction when this embodiment is employed.

1. A semiconductor device wherein a current flows in a deflected beammade of a semiconductor.
 2. The semiconductor device as claimed in claim1, wherein the beam has a doubly-clamped beam structure in which bothends are fixed and tensile strain is applied in a beam direction.
 3. Thesemiconductor device as claimed in claim 1, wherein the beam is used asa channel region in an FET.
 4. The semiconductor device as claimed inclaim 3, wherein the FET is a FinFET which uses at least the sidesurface of the beam as a channel region.
 5. The semiconductor device asclaimed in claim 3, wherein the FET is a planar type FET which uses theupper surface of the beam as a channel region.
 6. The semiconductordevice as claimed in claim 2, wherein the center of the beam is incontact with a void bottom under the beam.
 7. The semiconductor deviceas claimed in claim 6, wherein the strain in the beam is controlled bythe length of the beam before the beam is deflected and the depth of thevoid under the beam.
 8. The semiconductor device as claimed in claim 7,wherein the semiconductor device comprises a plurality of FinFETs andcomprises at least two types of FinFETs in which strain is differentlyintroduced by altering at least one of the length of the beam before thebeam is deflected and the depth of the void under the beam.
 9. A processfor manufacturing a semiconductor device wherein a current flows in adeflected beam made of a semiconductor, comprising the steps of: forminga straight beam having a doubly-clamped beam structure made of thesemiconductor by forming a void under the beam; filling the void with aliquid; and contacting the center of the beam with the bottom of thevoid by drying the liquid to form a deflected beam.
 10. The process formanufacturing a semiconductor device as claimed in claim 9, wherein theliquid is water or mercury.
 11. The process for manufacturing asemiconductor device as claimed in claim 9, further comprising preparinga substrate having a first layer made of the semiconductor constitutingthe beam and a second layer under the first layer which is made of amaterial having a different etching rate from the first layer before theforming the straight beam having a doubly-clamped beam structure,wherein the forming the straight beam having a doubly-clamped beamstructure is forming a void in a part under the first layer by etchingoff at least part of the second layer.
 12. A process for manufacturing aFinFET comprising: preparing an SOI substrate in which a buriedinsulating film and a semiconductor layer are stacked on a substrate;patterning the semiconductor layer to form a Fin having a given width;forming a void under the Fin by etching the buried insulating film underthe Fin to provide a straight beam; filling the void with a liquid; andcontacting the Fin with the bottom of the void by drying the liquid todeflect the Fin.
 13. The semiconductor device as claimed in claim 3,wherein the beam is used as a channel region in an FET.
 14. Thesemiconductor device as claimed in claim 3, wherein the center of thebeam is in contact with a void bottom under the beam.
 15. Thesemiconductor device as claimed in claim 4, wherein the center of thebeam is in contact with a void bottom under the beam.
 16. Thesemiconductor device as claimed in claim 5, wherein the center of thebeam is in contact with a void bottom under the beam.
 17. The processfor manufacturing a semiconductor device as claimed in claim 10, furthercomprising preparing a substrate having a first layer made of thesemiconductor constituting the beam and a second layer under the firstlayer which is made of a material having a different etching rate fromthe first layer before the forming the straight beam having adoubly-clamped beam structure,